Please use this identifier to cite or link to this item: https://hdl.handle.net/1822/53350

TitleHomogenization on multi-materials' elements: application to printed circuit boards and warpage analysis
Author(s)Araújo, Manuel
Alves, J. L.
Silva, Paulo
Delgado, Pedro
Issue date2016
PublisherEDP Sciences
JournalMATEC Web of Conferences
Abstract(s)Multi-material domains are often found in industrial applications. Modelling them can be computationally very expensive due to meshing requirements. The finite element properties comprising different materials are hardly accurate. In this work, a new homogenization method that simplifies the computation of the homogenized Young modulus, Poisson ratio and thermal expansion coefficient is proposed, and applied to composite-like material on a printed circuit board. The results show a good properties correspondence between the homogenized domain and the real geometry simulation.
TypeConference paper
URIhttps://hdl.handle.net/1822/53350
DOI10.1051/matecconf/20168016009
ISSN2261-236X
e-ISSN2261-236X
Publisher versionhttps://www.matec-conferences.org/articles/matecconf/abs/2016/43/matecconf_numi2016_16009/matecconf_numi2016_16009.html
Peer-Reviewedyes
AccessOpen access
Appears in Collections:DEM - Publicações em actas de encontros científicos / Papers in conference proceedings

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