Utilize este identificador para referenciar este registo:
https://hdl.handle.net/1822/53794
Título: | A 45° saw-dicing process applied to a glass substrate for wafer-level optical splitter fabrication for optical coherence tomography |
Autor(es): | Maciel, M. J. Costa, C. G. Silva, M. F. Gonçalves, S. B. Peixoto, A. C. Ribeiro, A. Fernando Wolffenbuttel, R. F. Correia, J. H. |
Palavras-chave: | optical coherence tomography 45° saw-dicing technology glass roughness MOEMS 45 degrees saw-dicing technology |
Data: | 2016 |
Editora: | IOP Publishing |
Revista: | Journal of Micromechanics and Microengineering |
Resumo(s): | This paper reports on the development of a technology for the wafer-level fabrication of an optical Michelson interferometer, which is an essential component in a micro optoelectromechanical system (MOEMS) for a miniaturized optical coherence tomography (OCT) system. The MOEMS consists on a titanium dioxide/silicon dioxide dielectric beam splitter and chromium/gold micro-mirrors. These optical components are deposited on 45° tilted surfaces to allow the horizontal/vertical separation of the incident beam in the final microintegrated system. The fabrication process consists of 45° saw dicing of a glass substrate and the subsequent deposition of dielectric multilayers and metal layers. The 45° saw dicing is fully characterized in this paper, which also includes an analysis of the roughness. The optimum process results in surfaces with a roughness of 19.76 nm (rms). The actual saw dicing process for a high-quality final surface results as a compromise between the dicing blade’s grit size (#1200) and the cutting speed (0.3mm s−1). The proposed wafer-level fabrication allows rapid and low-cost processing, high compactness and the possibility of wafer-level alignment/ assembly with other optical micro components for OCT integrated imaging |
Tipo: | Artigo |
URI: | https://hdl.handle.net/1822/53794 |
DOI: | 10.1088/0960-1317/26/8/084001 |
ISSN: | 0960-1317 |
Arbitragem científica: | yes |
Acesso: | Acesso aberto |
Aparece nas coleções: | CAlg - Artigos em revistas internacionais / Papers in international journals CMEMS - Artigos em livros de atas/Papers in proceedings |
Ficheiros deste registo:
Ficheiro | Descrição | Tamanho | Formato | |
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Maciel_2016_J._Micromech._Microeng._26_084001.pdf | 923,81 kB | Adobe PDF | Ver/Abrir |
Este trabalho está licenciado sob uma Licença Creative Commons