Please use this identifier to cite or link to this item: https://hdl.handle.net/1822/70358

TitleAdvanced electrically conductive adhesives for high complexity PCB assembly
Author(s)Lopes, Paulo Estevão Caldeira
Moura, Duarte Alexandre Campos Serra
Freitas, D.
Proença, M. Fernanda R. P.
Figueiredo, H.
Alves, R.
Paiva, M. C.
Issue date2019
PublisherAIP Publishing
JournalAIP Conference Proceedings
Abstract(s)Electronic packaging, or assembly of packed electronic components on printed circuit boards, present challenges that require innovative solder pastes and electrically conductive adhesives to face the increasing complexity of PCB assembly, with denser board occupation and demanding thermal management during assembly. Our aim is to prepare carbon particle based conductive adhesives. The first step to achieve this goal was to prepare composites with epoxy resin and a variety of nano to micron scale carbon particle, produced by mixing on a three roll mill. The percolation threshold for each particle type was determined as well as the conductivity level reached after percolation.
TypeConference paper
URIhttps://hdl.handle.net/1822/70358
ISBN9780735417830
DOI10.1063/1.5084887
ISSN0094-243X
e-ISSN1551-7616
Publisher versionhttps://aip.scitation.org/doi/abs/10.1063/1.5084887
Peer-Reviewedyes
AccessOpen access
Appears in Collections:IPC - Artigos em revistas científicas internacionais com arbitragem

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