Please use this identifier to cite or link to this item: https://hdl.handle.net/1822/70358

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dc.contributor.authorLopes, Paulo Estevão Caldeirapor
dc.contributor.authorMoura, Duarte Alexandre Campos Serrapor
dc.contributor.authorFreitas, D.por
dc.contributor.authorProença, M. Fernanda R. P.por
dc.contributor.authorFigueiredo, H.por
dc.contributor.authorAlves, R.por
dc.contributor.authorPaiva, M. C.por
dc.date.accessioned2021-02-22T08:58:55Z-
dc.date.available2021-02-22T08:58:55Z-
dc.date.issued2019-
dc.identifier.isbn9780735417830por
dc.identifier.issn0094-243Xpor
dc.identifier.urihttps://hdl.handle.net/1822/70358-
dc.description.abstractElectronic packaging, or assembly of packed electronic components on printed circuit boards, present challenges that require innovative solder pastes and electrically conductive adhesives to face the increasing complexity of PCB assembly, with denser board occupation and demanding thermal management during assembly. Our aim is to prepare carbon particle based conductive adhesives. The first step to achieve this goal was to prepare composites with epoxy resin and a variety of nano to micron scale carbon particle, produced by mixing on a three roll mill. The percolation threshold for each particle type was determined as well as the conductivity level reached after percolation.por
dc.description.sponsorshipThis research is sponsored by the Portugal Incentive System for Research and Technological Development. Project in co-promotion nº 002814/2015 (iFACTORY 2015-2018).por
dc.language.isoengpor
dc.publisherAIP Publishingpor
dc.rightsopenAccesspor
dc.titleAdvanced electrically conductive adhesives for high complexity PCB assemblypor
dc.typeconferencePaper-
dc.peerreviewedyespor
dc.relation.publisherversionhttps://aip.scitation.org/doi/abs/10.1063/1.5084887por
oaire.citationVolume2055por
dc.identifier.eissn1551-7616por
dc.identifier.doi10.1063/1.5084887por
dc.subject.wosScience & Technologypor
sdum.journalAIP Conference Proceedingspor
sdum.conferencePublicationPROCEEDINGS OF THE EUROPE/AFRICA CONFERENCE DRESDEN 2017 - POLYMER PROCESSING SOCIETY PPSpor
Appears in Collections:IPC - Artigos em revistas científicas internacionais com arbitragem

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