Utilize este identificador para referenciar este registo: https://hdl.handle.net/1822/52416

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dc.contributor.authorAbrantes, Ruipor
dc.contributor.authorSilva, Antonio M.P.por
dc.contributor.authorVarajão, Joãopor
dc.contributor.authorMagalhães, Luís Gonzaga Mendespor
dc.contributor.authorRibeiro, Pedropor
dc.contributor.authorFreitas, Luis Cesarpor
dc.date.accessioned2018-03-14T17:49:04Z-
dc.date.issued2017-
dc.identifier.isbn9781538611272por
dc.identifier.issn1553-572Xpor
dc.identifier.urihttps://hdl.handle.net/1822/52416-
dc.description.abstractThe design of a printed circuit board (PCB) is an example of the variety of technologies that have to be combined in a single physical output. Thus the need for collaboration between engineering teams, each of which with their own expertise (e.g. electrical, mechanical, testing and manufacturing) is of paramount importance. This imposes the need to share the electrical design and the PCB layout among different expertise teams that participate in a common electronic product development. The effective collaboration between the various teams can bring tremendous gains during the development phase as well as during the production phase, by increasing product performance and avoiding production issues. However these teams often face the problem that each of these teams are using different tools that do not enable sharing PCB layout data. An overview of the advances in this field is presented in this paper. In the context of a real electronic product manufacturer, this paper presents the PCB data exchange requirements and the analysis of how existing Electronic Computer-Aided Design (ECAD) file formats meet those same requirements. A reflection is made about the challenges that latest developments face. Lastly, future research perspectives are drawn.por
dc.description.sponsorshipThis work was funded by the project “iFACTORY: Novas Capacidades de Industrialização”, with reference 002814 supported by FEDER trough “Portugal 2020 – Programa Operacional Competitividade e Internacionalização” (COMPETE 2020). This work has been supported by COMPETE: POCI-01-0145-FEDER-007043 and FCT – Fundação para a Ciência e Tecnologia within the Project Scope: UID/CEC/00319/2013.por
dc.language.isoengpor
dc.publisherIEEEpor
dc.relationinfo:eu-repo/grantAgreement/FCT/5876/147280/PTpor
dc.rightsrestrictedAccesspor
dc.rights.urihttp://creativecommons.org/licenses/by/4.0/por
dc.subjectdata exchange formatpor
dc.subjectprinted circuit boardpor
dc.subjectdesign collaborationpor
dc.titleData exchange format requirements and analysis collaboration in PCB designpor
dc.typeconferencePaperpor
dc.peerreviewedyespor
dc.relation.publisherversionThe original publication is available at http://ieeexplore.ieee.org/document/8216578/por
oaire.citationStartPage3413por
oaire.citationEndPage3418por
oaire.citationConferencePlaceBeijing, Chinapor
oaire.citationVolume2017-Januarypor
dc.identifier.doi10.1109/IECON.2017.8216578por
dc.subject.fosCiências Naturais::Ciências da Computação e da Informaçãopor
dc.description.publicationversioninfo:eu-repo/semantics/publishedVersionpor
dc.subject.wosScience & Technologypor
sdum.journalIEEE Open Journal of the Industrial Electronics Societypor
sdum.conferencePublicationIECON 2017 - 43RD ANNUAL CONFERENCE OF THE IEEE INDUSTRIAL ELECTRONICS SOCIETYpor
Aparece nas coleções:CAlg - Artigos em livros de atas/Papers in proceedings

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