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https://hdl.handle.net/1822/91353
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Campo DC | Valor | Idioma |
---|---|---|
dc.contributor.author | Gonçalves, Sandra Beatriz Tomé | por |
dc.contributor.author | Oliveira, Maria J. | por |
dc.contributor.author | Peixoto, Alexandre Coumiotis Moreira | por |
dc.contributor.author | Ferreira da Silva, Alexandre | por |
dc.contributor.author | Correia, J. H. | por |
dc.date.accessioned | 2024-05-14T15:03:27Z | - |
dc.date.issued | 2016 | - |
dc.identifier.citation | Goncalves, S.B., Oliveira, M.J., Peixoto, A.C. et al. Out-of-plane neural microelectrode arrays fabrication using conventional blade dicing. Int J Adv Manuf Technol 85, 431–442 (2016). https://doi.org/10.1007/s00170-015-7948-7 | por |
dc.identifier.issn | 0268-3768 | por |
dc.identifier.uri | https://hdl.handle.net/1822/91353 | - |
dc.description.abstract | This paper describes an optimized out-of-plane fabrication method for neural 3D high-aspect-ratio microelectrode array (MEA) based on a dicing technology platform (a standard procedure in semiconductor industry). The proposed MEA fabrication required important modifications in the dicing process. Since electrodes length reaches up to 4 mm, the main hindrance was the 2 mm cutting depth limit allowed for dicing machines with regular blades. This new procedure consisted on modifying Z-axis calibration, so cuts as deep as the exposure of blades were possible. The employment of proper blades for each fabrication step was also mandatory. Thin and high-exposure blades were used for deep cuts in silicon wafers, and V-shaped blades were employed to produce sharpened tips on the electrodes. Moreover, parameters as very low-cut speeds were essential to avoid wafer chipping and microcracks. Results showed high-precision and high-quality cuts in all steps of the 3D MEA fabrication, without unnecessary additional steps of etching post-processing. The optimized fabrication process was successfully demonstrated with a 3D neural probe array comprising 36 individually addressable electrodes. | por |
dc.description.sponsorship | A. C. Peixoto is supported by the Portuguese Foundation for Science and Technology (SFRH/BD/89509/2012). | por |
dc.language.iso | eng | por |
dc.publisher | Springer | por |
dc.relation | info:eu-repo/grantAgreement/FCT/FARH/SFRH%2FBD%2F89509%2F2012/PT | por |
dc.rights | restrictedAccess | por |
dc.subject | Dicing saw | por |
dc.subject | Diamond blade | por |
dc.subject | Neural microelectrode array | por |
dc.subject | Silicon wafer | por |
dc.title | Out-of-plane neural microelectrode arrays fabrication using conventional blade dicing | por |
dc.type | article | - |
dc.peerreviewed | yes | por |
dc.relation.publisherversion | https://link.springer.com/article/10.1007/s00170-015-7948-7 | por |
oaire.citationStartPage | 431 | por |
oaire.citationEndPage | 442 | por |
oaire.citationIssue | 1-4 | por |
oaire.citationVolume | 85 | por |
dc.date.updated | 2024-03-14T12:18:59Z | - |
dc.identifier.doi | 10.1007/s00170-015-7948-7 | por |
dc.date.embargo | 10000-01-01 | - |
dc.subject.wos | Science & Technology | - |
sdum.export.identifier | 2468 | - |
sdum.journal | The International Journal of Advanced Manufacturing Technology | por |
Aparece nas coleções: | DEI - Artigos em revistas internacionais |
Ficheiros deste registo:
Ficheiro | Descrição | Tamanho | Formato | |
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10.10072Fs00170-015-7948-7.pdf Acesso restrito! | 17,38 MB | Adobe PDF | Ver/Abrir |