Utilize este identificador para referenciar este registo:
https://hdl.handle.net/1822/8640
Título: | Fabrication of flexible thermoelectric microcoolers using planar thin-film technologies |
Autor(es): | Gonçalves, L. M. Rocha, J. G. Couto, Carlos Alpuim, P. Min, Gao Rowe, D. M. Correia, J. H. |
Palavras-chave: | Peltier Flexible |
Data: | Jul-2007 |
Editora: | IOP Publishing Ltd |
Revista: | Journal of Micromechanics and Microengineering |
Citação: | "Journal of Micromechanics and Microengineering". ISSN 0960-1316. 17:7 (July 2007) S168-S173. |
Resumo(s): | The present work reports on the fabrication and characterization of a planar Peltier cooler on a flexible substrate. The device was fabricated on a 12 νm thick Kapton(c) polyimide substrate using Bi2Te3 and Sb2Te3 thermoelectric elements deposited by thermal co-evaporation. The cold area of the device is cooled with four thermoelectric junctions, connected in series using metal contacts. Plastic substrates add uncommon mechanical properties to the composite film-substrate and enable integration with novel types of flexible electronic devices. Films were deposited by co-evaporation of tellurium and bismuth or antimony to obtain Bi2Te3 or Sb2Te3, respectively. Patterning of the thermoelectric materials using lift-off and wet-etching techniques was studied and compared. The performance of the Peltier microcooler was analysed by infrared image microscopy, on still-air and under vacuum conditions, and a maximum temperature difference of 5 °C was measured between the cold and the hot sides of the device. © 2007 IOP Publishing Ltd. |
Tipo: | Artigo |
URI: | https://hdl.handle.net/1822/8640 |
DOI: | 10.1088/0960-1317/17/7/S14 |
ISSN: | 0960-1316 |
Versão da editora: | www.iop.org |
Arbitragem científica: | yes |
Acesso: | Acesso aberto |
Aparece nas coleções: | DEI - Artigos em revistas internacionais |
Ficheiros deste registo:
Ficheiro | Descrição | Tamanho | Formato | |
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Paper JMM MME06 published.pdf | 957,1 kB | Adobe PDF | Ver/Abrir |