Utilize este identificador para referenciar este registo: https://hdl.handle.net/1822/1558

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dc.contributor.authorTrabulo, Pedro-
dc.contributor.authorDurães, Dalila-
dc.contributor.authorMendes, P. M.-
dc.contributor.authorGarrido, Paulo-
dc.contributor.authorCorreia, J. H.-
dc.date.accessioned2005-05-12T10:34:57Z-
dc.date.available2005-05-12T10:34:57Z-
dc.date.issued2004-
dc.identifier.citationMARTINS, Rodrigo [et al.], ed. lit. - "Advanced materials forum II : proceedings of the International Materials Symposium, 2, Costa da Caparica, 2003". Zürich : Trans Tech Publications, 2004. ISBN 0-87849-941-5. vol. 455-456, p. 116-119.eng
dc.identifier.isbn0-87849-941-5-
dc.identifier.issn0255-5476por
dc.identifier.urihttps://hdl.handle.net/1822/1558-
dc.description.abstractThis paper presents the design and fabrication of integrated micromachined inductors on silicon substrates. In order to reduce eddy currents in silicon substrates, bulk-micromachining technology is used to etch the silicon wafer. In this way, aluminum spiral micromachined inductors can achieve a quality factor Q of approximately 30 (0.6-2 nH @ 2-15 GHz). Also, the resistivity of the inductors material is discussed.eng
dc.description.sponsorshipFundação para a Ciência e Tecnologia (FCT)eng
dc.language.isoengeng
dc.publisherTrans Tech Publicationseng
dc.rightsopenAccesseng
dc.subjectSilicon spiral inductorseng
dc.subjectBulk-micromachiningeng
dc.subjectRFIC deviceseng
dc.subjectBulk-micromachining technologypor
dc.titleSpiral inductors on silicon for wireless communicationseng
dc.typeconferencePapereng
dc.peerreviewedyeseng
oaire.citationStartPage116por
oaire.citationEndPage119por
oaire.citationVolume455-456por
dc.subject.wosScience & Technologypor
sdum.journalMaterials Science Forumpor
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