Utilize este identificador para referenciar este registo:
https://hdl.handle.net/1822/1562| Título: | Folded-patch chip-size antennas for wireless microsystems |
| Autor(es): | Mendes, P. M. Polyakov, A. Bartek, M. Burghartz, J. N. Correia, J. H. |
| Palavras-chave: | Folded patch antenna Chip size antenna Antenna integration |
| Data: | Nov-2003 |
| Citação: | SAFE. Annual Workshop on Semi-conductor Advances for Future Electronics, Veldhoven, 2003. "Proceedings of SAFE 2003". Veldhoven : [s.n.], 2003. ISBN 90-73461-39-1. p. 748-752. |
| Resumo(s): | We report on design and fabrication of a folded-patch chip-size antenna for operation at 5.7 GHz and use in short-range wireless communications. Application of wafer-level chip-scale packaging (WLCSP) techniques like adhesive wafer bonding and through-wafer electrical via formation, combined with the selected antenna type allows on-chip integration and is the main novelty of our design work. This antenna, built on two stacked substrates, allows size reduction down to 4.5x4x1 mm3 and has projected efficiency of 66%. |
| Tipo: | Artigo em ata de conferência |
| URI: | https://hdl.handle.net/1822/1562 |
| ISBN: | 90-73461-39-1 |
| Arbitragem científica: | yes |
| Acesso: | Acesso aberto |
| Aparece nas coleções: | DEI - Artigos em atas de congressos internacionais |
Ficheiros deste registo:
| Ficheiro | Descrição | Tamanho | Formato | |
|---|---|---|---|---|
| SAFE2003.pdf | 560,4 kB | Adobe PDF | Ver/Abrir |
