Comparison between bulk micromachined and CMOS x-ray detectors

dc.contributor.authorRocha, J. G.
dc.contributor.authorSchabmueller, C. G. J.
dc.contributor.authorRamos, N. F.
dc.contributor.authorLanceros-Méndez, S.
dc.contributor.authorEvans, A. G. R.
dc.contributor.authorWolffenbuttel, R. F.
dc.contributor.authorCorreia, J. H.
dc.date.accessioned2005-06-13T12:35:04Z
dc.date.available2005-06-13T12:35:04Z
dc.date.issued2004
dc.description.abstractThis paper compares two x-ray detectors fabricated using two different technologies: one is based on a bulk micromachined silicon photodetector and the other is based on a standard CMOS photodetector. The working principle of the two detectors is similar: a scintillating layer of CsI:Tl is placed above the photodetector, so the x-rays are first converted into visible light (560nm) which is then converted into an electrical signal by the photodetector. The different aspects of the fabrication and the experimental results of both x-ray detectors are presented and discussed.eng
dc.distributioninternationaleng
dc.identifier.citation"Sensors and Actuators A : Physical". ISSN 0924-4247. 115 (2004). p. 215-220.eng
dc.identifier.doi10.1016/j.sna.2004.02.035por
dc.identifier.issn0924-4247
dc.identifier.urihttps://hdl.handle.net/1822/2156
dc.language.isoengeng
dc.peerreviewedyeseng
dc.publisherElseviereng
dc.relation.publisherversionhttp://www.elsevier.com/locate/sna
dc.rightsopenAccesseng
dc.subjectX-rayseng
dc.subjectScintillatoreng
dc.subjectMicromachiningeng
dc.subject.wosScience & Technologypor
dc.titleComparison between bulk micromachined and CMOS x-ray detectorseng
dc.typearticleeng
dspace.entity.typePublicationen
oaire.citationEndPage220por
oaire.citationIssue2-3por
oaire.citationStartPage215por
oaire.citationVolume115por
sdum.journalSensors and Actuators A: Physicalpor

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