Temperature calibration for distributed temperature sensing of printed circuit boards using optical fiber sensors

dc.contributor.authorLeite, Tiago Mauriciopor
dc.contributor.authorFreitas, Claúdiapor
dc.contributor.authorMagalhães, Robertopor
dc.contributor.authorSilva, Alexandre F.por
dc.contributor.authorFerreira da Silva, Alexandrepor
dc.contributor.authorAlves, José Ricardopor
dc.contributor.authorViana, J. C.por
dc.contributor.authorDelgado, Isabelpor
dc.date.accessioned2024-03-15T12:14:30Z
dc.date.embargo10000-01-01
dc.date.issued2023-09
dc.date.updated2024-03-13T17:05:20Z
dc.description.abstractThe work investigates the procedures for temperature calibration of optical fiber sensors (OFSs), implemented on printed circuit boards (PCBs), aiming to accomplish accurate distributed temperature measurements, during temperature cycles. The OFSs are interrogated by optical frequency-domain reflectometry, OFDR, which provides plenty of sensing points using a single OF. For temperature measurements, it was used a polyimide-coated optical fiber within a PTFE sleeve and conventional type-K thermocouples, as a temperature reference. Samples with different OFS dispositions were placed in a static oven under distinct programmed temperature profiles. The temperature calibration correlates the OFS signal frequency shift to the temperature profile registered by reference thermocouples. The proposed calibration methodology results in temperature measurement with low error (±1 °C/3%). Different calibration fittings were obtained depending upon the type of OF configuration and temperature profile used (temperature ranges and rates) since some calibration curves showed an undesired 'bow effect' (hysteresis), which appears to be dependent on the heating/cooling rates. The results of OF within PTFE sleeve, bonded to a PCB and covered with aluminum tape, present smaller deviations and a more stable signal. Nevertheless, the calibration of OFS for distributed temperature measurements is still dependent on application-oriented calibration adjustment.por
dc.description.sponsorshipThis work was supported in part by the European Structural and Investment Funds in the Fundo Europeu de Desenvolvimento Regional (FEDER) Component through the Operational Competitiveness and Internationalization Programme (COMPETE 2020) under Project 39479 (Funding Reference: POCI-01-0247-FEDER-39479); and in part by the FEDER Funds through the COMPETE 2020 Program and National Funds through Fundação para a Ciência e a Tecnologia (FCT) under Grant UIDB/05256/2020 (IPC), Grant UIDP/05256/2020 (IPC), Grant UIDB/04436/2020 (CMEMS),and Grant UIDP/04436/2020 (CMEMSpor
dc.distributioninternationalpor
dc.identifier.citationLeite, T. M., Freitas, C., Magalhães, R., Ferreira da Silva, A., Alves, J. R., Viana, J. C., & Delgado, I. (2023, September). Temperature Calibration for Distributed Temperature Sensing of Printed Circuit Boards Using Optical Fiber Sensors. IEEE Transactions on Components, Packaging and Manufacturing Technology. Institute of Electrical and Electronics Engineers (IEEE). http://doi.org/10.1109/tcpmt.2023.3312565
dc.identifier.doi10.1109/TCPMT.2023.3312565por
dc.identifier.eissn2156-3985por
dc.identifier.issn2156-3950por
dc.identifier.urihttps://hdl.handle.net/1822/89593
dc.language.isoengpor
dc.peerreviewedyespor
dc.publisherIEEEpor
dc.relationinfo:eu-repo/grantAgreement/FCT/6817 - DCRRNI ID/UIDB%2F05256%2F2020/PTpor
dc.relationinfo:eu-repo/grantAgreement/FCT/6817 - DCRRNI ID/UIDP%2F05256%2F2020/PTpor
dc.relationinfo:eu-repo/grantAgreement/FCT/6817 - DCRRNI ID/UIDB%2F04436%2F2020/PTpor
dc.relationinfo:eu-repo/grantAgreement/FCT/6817 - DCRRNI ID/UIDP%2F04436%2F2020/PTpor
dc.relation.publisherversionhttps://ieeexplore.ieee.org/document/10242096por
dc.rightsrestrictedAccesspor
dc.subjectOptical fiber sensors (OFSs)por
dc.subjectoptical frequency-domain reflectometry (OFDR)por
dc.subjectprinted circuit board (PCB)por
dc.subjecttemperature calibrationpor
dc.titleTemperature calibration for distributed temperature sensing of printed circuit boards using optical fiber sensorspor
dc.typearticle
dspace.entity.typePublicationen
oaire.citationEndPage1387por
oaire.citationIssue9por
oaire.citationStartPage1380por
oaire.citationVolume13por
sdum.export.identifier13386
sdum.journalIEEE Transactions on Components, Packaging and Manufacturing Technologypor

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