Decoupling of temperature and strain effects on optical fiber-based measurements of thermomechanical loaded printed circuit board assemblies

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Acesso restrito (UMinho)

Revisto por pares

Decoupling of temperature and strain effects on optical fiber-based measurements of thermomechanical loaded printed circuit board assemblies

Autor(es)

Leite, Tiago Maurício Freitas, Cláudia Magalhães, Roberto Ferreira da Silva, Alexandre

Alves, José R. Viana, J. C.

Delgado, Isabel

Ficheiros

Decoupling-of-Temperature-and-Strain-Effects-on-Optical-FiberBased-Measurements-of-Thermomechanical-Loaded-Printed-Circuit-Board-AssembliesSensors-Basel-Switzerland.pdf (4.54 MB)

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10000-01-01

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IPC - Artigos em revistas científicas internacionais com arbitragem | Articles in peer-reviewed international scientific journals

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